Okpu ngwụcha Okpomọkụ

Nkọwa dị mkpirikpi:

1. A na-eji ya mechie eriri eriri n'oge ntinye ma ọ bụ nchekwa, na-echebe eriri USB megide oxidation, ozone, UV, wdg.
2. Na-ekpuchi ya na ihe mkpuchi na-ekpo ọkụ na-ekpo ọkụ iji hụ na njedebe nke eriri eriri a pụrụ ịdabere na ya
3. Na-aga n'ihu ọrụ okpomọkụ: -45 ℃ ka 105 ℃
4. Mbelata okpomọkụ: malite na 110 ℃, na n'ụzọ zuru ezu gbakee na 130 ℃
5. Oke nkwụghachi: 2:1

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Nkọwa ngwaahịa

Mkpado ngwaahịa

Data teknụzụ

Ngwongwo	Usoro ule	Ọkọlọtọ Uru
Okpomọkụ arụ ọrụ	IEC 216	-45 ℃ ruo 105 ℃
Ike ọdụdọ	ASTM-D-2671	≥12MPa
Elongation na ezumike	ASTM-D-2671	≥300%
Ike tensile mgbe ịkachara	ASTM-D-2671	≥10MPa (130 ℃, 168hrs)
Elongation na ezumike	ASTM-D-2671	≥230% (130 ℃, 168 elekere)
mgbe ịkachara	ASTM-D-2671	≥230% (130 ℃, 168 elekere)
Ike Dielectric	IEC 60243	≥20kV/mm
Nguzogide mgbawa nrụgide	ASTM-D-1693	Enweghị mgbawa
Mgbochi olu	IEC 60093	≥1 × 1014Ω·cm
Fungus na Nguzogide Nreka	ISO 846	Gafe
Ogologo Mbelata	ASTM-D-2671	≤10%
Eccentricity	ASTM-D-2671	≤30%
Mmiri Absorption	ISO 62	≤0.5%

Akụkụ

Nha	D/mm		L/mm	W/mm
	D/mm			Dị ka e nyere	Mgbe mgbake
	Dị ka e nyere	Mgbe mgbake		Dị ka e nyere	Mgbe mgbake
11/6	≥11	≤6	≥22	0.7±0.1	≤1.1
16/8	≥16	≤8	≥70	1.2 ± 0.1	≤2.2
20/8	≥20	≤8	≥70	1.2 ± 0.1	≤2.2
25/11	≥25	≤11	≥80	1.2 ± 0.1	≤2.3
32/16	≥32	≤16	≥90